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                  ENGINEERING NEWS IN BRIEF
                        E-Mail Newsletter

                               No.44
             Issued by the Asian TOP Panel, August 2005



           The Chinese Mechanical Engineering Society (CMES)
           The Institution of Engineers, Indonesia (PII)
           The Japan Society of Mechanical Engineers (JSME)
           The Korean Society of Mechanical Engineers (KSME)

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    According to the agreement made in the 2nd Asian TOP Panel Meeting,
the ENGINEERING NEWS IN BRIEF (E-mail newsletter) has now been edited
by the KSME for the year 2005.

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[Contents]

(1) Image Measurement on Internal Thread of Ball Screws (Source: CMES)
(2) Engineering Change Management in Manufacturing: A State of the Art Survey (Source: CMES)
(3) Extense Design Method of Products in Domain of Mass (Source: CMES)
(4) IC tags: Interface among Human, Object and Information - Hope of Promoting
Product Reuse and Recycle - (Source: JSME)
(5) Advanced Neutral Beam for Ultimate Top-down Etching (Source: JSME)
(6) Stent Design Using Computational Fluid Dynamics (Source : KSME)
(7) Measurement of the Thermal Conductivity of Alumina/Zinc-Oxide/Titanium-Oxide Nanofluids (Source : KSME)


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(1) Image Measurement on Internal Thread of Ball Screws (Source: CMES)

Prof. Liu Qingmin Prof. Wang Longshan Jilin University

In order to realize non-destruction detection and parameter measurement on internal thread of ball screws in one system, Prof. Liu Qingmin and Prof. Wang Longshan from Jilin University proposed a non-contact measurement method, which was based on image processing technology and industrial CT technology. Original gray level image collected by industrial CT device was changed into macroscopical drawing information after processed by pre-processing, threshold selection, bivalency image, edge detection and contour extraction etc. In measuring, based on the segmented contour line of internal thread of ball screws, compiled measurement program to calculate and measure such geometrical parameters of the internal thread of ball screws as tooth shape arc, radius of ball center, ball way jumpiness and pitch, and the reason of errors was analyzed. Errors of tooth shape arc, radius of ball center, ball way jumpiness and pitch can reach 0.017mm, } 0.015mm, 0.013mm and } 0.025mm respectively. The results satisfy with the technical requirements of production.

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(2) Engineering Change Management in Manufacturing: A State of the Art Survey (Source: CMES)

Prof. Liu Xiaobing Prof. Meng Yongsheng Dalian University of Technology

Engineering Change ( EC) is an inevitable part of production data management in manufacturing industry. Sources, categories, primary problems, involved activities and typical support systems for engineering change were introduced by Prof. Liu Xiaobing and Prof. Meng Yongsheng. In addition, state of the art in this area was reviewed and summarized in aspects of tools, methods and enterprise investigation respectively. As a conclusion, it is put forward from an unique view what is the key technologies and the trend of engineering change implementation.

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(3) Extense Design Method of Products in Domain of Mass Customization
(Source: CMES)

Prof. Ma Hui Prof. Tan Jianrong Zhejiang University

The status of research on design for Mass Customization were analyzed by Prof. Ma Hui and Prof. Tan Jianrong. With an eye to the advantage of matter- element, a new model of MV produces was established. And this new model included all design processes of MC products. Using the extensibility of matter ? element, design processes of MC products were developed and the normativeness and reusability of MC product design were enhanced. Another important advantage of affair?matter?element was that it can support merit rating. After merit rating, the final products were proposed to different customers. An example of electrostatic precipitator, a classic mass customization product with huge body and complex conformation, is given to illustrate relevant enable technologies for the methods mentioned.

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(4) IC tags: Interface among Human, Object and Information - Hope of Promoting Product Reuse and Recycle - (Source: JSME)

Toshitake TATENO: Tokyo Metropolitan University
Shinsuke KONDOH: Tokyo Metropolitan University

IC tag system is a new identification system which will replace the bar code tag system. There are many kinds of merits to use IC tag systems, for example, large capacity of recording, ability to write data by users, less possibility of failure by heat and dirt, ability to read tags behind obstacles, etc. Some supermarkets in U.S. and Europe decided to start using IC tags to check inventories.
We can see the IC tags will be widely used soon. In manufacturing system field, many companies are paying attention to the IC tag applications for integration of sales, production and delivery system. The authors expect that every product or component has an IC tag in near future, and the IC tags are used for product lifecycle management. Individual information of products is very important to decide which product can be reused or recycled. We expect that the IC tags promote the reuse and recycle process.

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(5) Advanced Neutral Beam for Ultimate Top-down Etching (Source : JSME)

Seiji SAMUKAWA: Tohoku University

Recent ultra-large-scale integration (ULSI) production processes involve fabricating sub-0.1-nm patterns on Si wafers. High-density plasma sources are key technologies for developing precise etching processes. The disadvantages of these technologies include several types of radiation damage caused by the charge build-up of positive ions and electrons or by ultraviolet and x-ray photons during etching. These are very serious problems that must be overcome in the fabrication of future nanoscale devices. To overcome these problems and achieve accurate nanoscale patterning, a high-performance neutral-beam etching system is required.

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(6) Stent Design Using Computational Fluid Dynamics (Source : KSME)

Professor Taewon Seo of Andong University reported an interesting paper about the design for stents used for treatment of blood vessel disease. (KSME Transactions B, vol .29, no. 9, 2005) Numerical investigation has been made on the stent design to minimize the neointimal hyperplasia. Computational fluid dynamics was applied to investigate the flow distributions in the immediate vicinity of the given idealized stent implanted in the blood vessel. Parametric study on the variations of the number of stents, stent diameters, stent spacings and Reynolds numbers has been conducted by solving axi-symmetric Navier-Stokes equations. The difficulty in the study was to determine the optimal stent design to understand the flow physics of the flow disturbance induced by stent. The size of recirculation zone around stent depends on the stent diameter, number of stent wire and Reynolds number but is insensitive to the stent wire spacing. It was also found that when the flow was in acceleration, the flow would experience a more favorable pressure gradient.

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(7) Measurement of the Thermal Conductivity of Alumina/Zinc-Oxide/Titanium-Oxide Nanofluids (Source : KSME)

Professor Dongsik Kim of Postech recently reported the measurements of nanofluids thermal conductivities (KSME Transactions B, vol .29, no. 9, 2005). The thermal conductivities of water- and ethylene glycol-based nanofluids containing alumina (Al2O3), zinc oxide (ZnO) and titanium dioxide (TiO2) nanoparticles were measured by varying the particle diameter and volume fraction. The transient hot-wire method using an anodized tantalum wire for electrical insulation was employed for the measurement. The experimental results show that nanofluids have substantially higher thermal conductivities than those of the base fluid and the ratio of thermal conductivity enhancement increases linearly with the volume fraction. It has been found that the ratio of thermal conductivity enhancement increases with decreasing particle size but no empirical or theoretical correlation could explain the particle-size dependence of the thermal conductivity. This work provided a set of consistent experimental data over a wide range of nanofluid conditions.

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Editor : Professor Mansoo Choi of Seoul National University,
           Director of General Affairs, KSME
           ksme@ksme.or.kr


 
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