Preparation of Manuscript

[Manuscript Template]
The Manuscript Template can be downloaded below. The authors must prepare their manuscript using the specified template and copyright-transfer sheet with signature.

Call for Paper

    We are planning to "Special Issue" in the Mechanical Engineering Journal. Please submit a suitable paper for the special issues.


Category abbreviation Divisions, Professional Committees and Promotion Committee
(Linking to Keyword)
Solid Mechanics and Materials Engineering SMM Materials & Mechanics Materials & Processing
Fluids Engineering FE Fluids Engineering
Thermal, Engine and Power Engineering TEP Thermal Engineering Engine Systems Power & Energy Systems
Dynamics & Control, Robotics & Mechatronics DR Dynamics, Measurement & Control Robotics & Mechatronics
Micro / Nano Science and Technology MN Micro-Nano Science & Technology
Computational Mechanics CM Computational Mechanics
Design, Manufacturing, Information and Systems DSM Machine Design & Tribology Design & Systems Manufacturing & Machine Tool Manufacturing Systems Information, Intelligence & Precision Equipment
Bio, Medical, Sports and Human Engineering BMS Bioengineering Sports engineering and Human Dynamics Biomedical Engineering and Technology
Environmental and Process Engineering, Safety EPS Environmental Engineering Industrial and Chemical Machinery & Safety
Transportation and Logistics TL Transportation & Logistics
Space Engineering SE Space Engineering
Law, History, Education and Management Engineering LH Technology & Society Law & Technology

Publishing Fees

An invoice will be sent after finalizing the decision to publish the manuscript in the bulletin. The author shall immediately pay the publication fee upon receiving the invoice. The amount of the Publishing Fees shall be determined separately.

Contact Details

The Japan Society of Mechanical Engineers, Headquarters

  • Shinanomachi Rengakan Bldg. 5th Floor
  • 35 Shinanomachi, Shinjuku-ku, Tokyo 160-0016, Japan
  • Phone:+81-3-5360-3502, FAX:+81-3-5360-3508
  • E-mail:

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